Semiconductor Packaging : Materials Interaction and Reliability, Paperback by…
USD 113.98 USD
Specifications
| ISBN | 9781138075405 |
| Publisher | CRC Press LLC |
| Item Length | 9.2 in |
| Publication Year | 2017 |
| Type | Textbook |
| Format | Trade Paperback |
| Language | English |
| Item Weight | 16 Oz |
| Item Width | 6.1 in |
| Number Of Pages | 216 Pages |
Semiconductor Packaging : Materials Interaction and Reliability, Paperback by Chen, Andrea; Lo, Randy Hsiao-yu, ISBN 113807540X, ISBN-13 9781138075405, Like New Used, Free shipping in the US This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
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